Our R&D and technical support staff has over five decades of experience in providing plating solutions. The team has expertise in the fields of electrochemistry, chemical engineering, materials science, physical chemistry, and environmental health & safety.
We provide support in all aspects of the plating process, including process development as well as anode design and modeling. Our process development services include plating and anodizing new components in addition to improving the deposit uniformity or efficiency of existing processes. If our standard plating products do not meet your plating requirements, we will work with you to develop a custom solution for your application.
We also provide application troubleshooting services. Some common plating issues that we often encounter and solve include high/low thickness, deposit uniformity, poor adhesion, and poor deposit quality. To ensure that our plating processes perform to application requirements, we also conduct tests for microhardness, salt spray, stereo microscopy, and X-ray fluorescence for material composition.
Dalic® Selectron® SIFCO Process®
